r/Metrology • u/gapbong • 17h ago
How often do you actually analyze raw 3D metrology data outside the tool software?
I've been talking with a few people here about wafer metrology, and I realized the workflow seems to vary a lot depending on whether you’re in production, R&D, or equipment development.
In high-volume production, it sounds like most of the analysis stays inside the metrology tool software.
But in R&D or development environments, people seem much more likely to export raw data and use their own scripts, Excel, JMP, or other post-processing tools.
So I’m curious:
How often do you actually take raw 2D/3D measurement data out of the equipment software and analyze it yourself?
And when you do, what are you usually trying to calculate or visualize that the original software doesn’t handle well?
Mostly interested in real workflows rather than specific software recommendations.